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发布中的Case(62)
  • 【IC】【深圳】EDA公司数字后端A... 年薪:30-60万| 深圳
  • 描述:①Lead/Principal Application Engineer-Digital Backend and Signoff (Location:深圳)Lead(MS3+/BS5+)/Principal(MS7+/BS9+)Physical Design经验。 Position Description:1. To provide key technical support in digital IC design implementation, product demonstration, and sales presentations.2. To demonstrate strong ability and to be hands-on in RTL-to-GDSII design methodology, including both challenging low power and high performance designs.3. Have real design experience including floorplan and partition, place,CTS, route, STA timing closure, Physical verification, RC extraction, Power Network analysis.4. Real tape-out project for full chip dynamic/static IR-Drop analysis5. Assist in technical evaluation, assessment and delivery of concurrent ASIC/SoCdesigns.6. To play a leading role among other team members, while receive little instructionon routine and general assignments.Position Requirements:1. A bachelor's degree is essential and 4+ years’ experience in IC design,electronic engineering or computer science applications.2. Ability to understand and articulate technical issues, (and knowledge of) design products and their applications.3. Requires working knowledge of one or more programming languages, and effective communication and soft skills.4. An MS degree and/or working experience in multi-nation IC design house/or familiar with EDI/Innovus product is a plus.5. Good communication in English and good work attitude.6. Be familiar with shell/perl/tcl etc. script languag②Principal Application Engineer-Physical Design (SZ) MS3+/BS5+physical design经验,做过功耗分析尤佳Position Description: ·To provide key technical support in digital IC design implementation, product demonstration, and sales presentations. ·To demonstrate strong ability and to be hands-on in RTL-to-GDSII design methodology, for challenging low power designs, for 200MHz to several GHz big chips. ·Have real design experience including conformal check, logic synthesys, P&R, CTS, SSTA, MMMC to close timing, power and die area. ·Assist in technical evaluation, assessment and delivery of concurrent ASIC/SoC designs. ·To play a leading role among other team members, while receive little instruction on routine and general assignments. Position Requirements: ·A bachelor's degree is essential and 7+ years’ experience in IC design, electronic engineering or computer science applications. ·Ability to understand and articulate technical issues, (and knowledge of) design products and their applications. ·Requires working knowledge of one or more programming languages, and effective communication and soft skills. ·An MS degree and/or working experience in multi-nation IC design house is a plus.欢迎咨询:QQ/E-mail:1158713891@QQ.comTel/WeChat: 18866916715 Tony
  • 技术设计| 电子半导体| 全球Top美资EDA公司
  • 【深圳IC】EDA公司数字后端AE 年薪:30-60万| 深圳
  • 描述:①Lead/Principal Application Engineer-Digital Backend and Signoff (Location:深圳)Lead(MS3+/BS5+)/Principal(MS7+/BS9+)Physical Design经验。 Position Description:1. To provide key technical support in digital IC design implementation, product demonstration, and sales presentations.2. To demonstrate strong ability and to be hands-on in RTL-to-GDSII design methodology, including both challenging low power and high performance designs.3. Have real design experience including floorplan and partition, place,CTS, route, STA timing closure, Physical verification, RC extraction, Power Network analysis.4. Real tape-out project for full chip dynamic/static IR-Drop analysis5. Assist in technical evaluation, assessment and delivery of concurrent ASIC/SoCdesigns.6. To play a leading role among other team members, while receive little instructionon routine and general assignments.Position Requirements:1. A bachelor's degree is essential and 4+ years’ experience in IC design,electronic engineering or computer science applications.2. Ability to understand and articulate technical issues, (and knowledge of) design products and their applications.3. Requires working knowledge of one or more programming languages, and effective communication and soft skills.4. An MS degree and/or working experience in multi-nation IC design house/or familiar with EDI/Innovus product is a plus.5. Good communication in English and good work attitude.6. Be familiar with shell/perl/tcl etc. script languag②Principal Application Engineer-Physical Design (SZ) MS3+/BS5+physical design经验,做过功耗分析尤佳Position Description: ·To provide key technical support in digital IC design implementation, product demonstration, and sales presentations. ·To demonstrate strong ability and to be hands-on in RTL-to-GDSII design methodology, for challenging low power designs, for 200MHz to several GHz big chips. ·Have real design experience including conformal check, logic synthesys, P&R, CTS, SSTA, MMMC to close timing, power and die area. ·Assist in technical evaluation, assessment and delivery of concurrent ASIC/SoC designs. ·To play a leading role among other team members, while receive little instruction on routine and general assignments. Position Requirements: ·A bachelor's degree is essential and 7+ years’ experience in IC design, electronic engineering or computer science applications. ·Ability to understand and articulate technical issues, (and knowledge of) design products and their applications. ·Requires working knowledge of one or more programming languages, and effective communication and soft skills. ·An MS degree and/or working experience in multi-nation IC design house is a plus.欢迎咨询:QQ/E-mail:1158713891@QQ.comTel/WeChat: 18866916715 Tony
  • 技术设计| 电子半导体| 全球Top美资EDA公司
  • 【深圳IC】美资EDA公司数字后端A... 年薪:30-60万| 深圳
  • 描述:①Lead/Principal Application Engineer-Digital Backend and Signoff (Location:深圳)Lead(MS3+/BS6+)/Principal(MS7+/BS9+)Physical Design经验。 Position Description:1. To provide key technical support in digital IC design implementation, product demonstration, and sales presentations.2. To demonstrate strong ability and to be hands-on in RTL-to-GDSII design methodology, including both challenging low power and high performance designs.3. Have real design experience including floorplan and partition, place,CTS, route, STA timing closure, Physical verification, RC extraction, Power Network analysis.4. Real tape-out project for full chip dynamic/static IR-Drop analysis5. Assist in technical evaluation, assessment and delivery of concurrent ASIC/SoCdesigns.6. To play a leading role among other team members, while receive little instructionon routine and general assignments.Position Requirements:1. A bachelor's degree is essential and 4+ years’ experience in IC design,electronic engineering or computer science applications.2. Ability to understand and articulate technical issues, (and knowledge of) design products and their applications.3. Requires working knowledge of one or more programming languages, and effective communication and soft skills.4. An MS degree and/or working experience in multi-nation IC design house/or familiar with EDI/Innovus product is a plus.5. Good communication in English and good work attitude.6. Be familiar with shell/perl/tcl etc. script languag②Principal Application Engineer-Physical Design (SZ) MS3+/BS6+physical design经验,做过功耗分析尤佳Position Description: ·To provide key technical support in digital IC design implementation, product demonstration, and sales presentations. ·To demonstrate strong ability and to be hands-on in RTL-to-GDSII design methodology, for challenging low power designs, for 200MHz to several GHz big chips. ·Have real design experience including conformal check, logic synthesys, P&R, CTS, SSTA, MMMC to close timing, power and die area. ·Assist in technical evaluation, assessment and delivery of concurrent ASIC/SoC designs. ·To play a leading role among other team members, while receive little instruction on routine and general assignments. Position Requirements: ·A bachelor's degree is essential and 7+ years’ experience in IC design, electronic engineering or computer science applications. ·Ability to understand and articulate technical issues, (and knowledge of) design products and their applications. ·Requires working knowledge of one or more programming languages, and effective communication and soft skills. ·An MS degree and/or working experience in multi-nation IC design house is a plus.QQ/E-mail:1158713891@QQ.comTel/WeChat: 18866916715 Tony
  • 生产制造| 电子半导体| 全球Top美资EDA公司
  • 【深圳】EDA公司数字IC后端/功耗... 年薪:30-55万| 深圳
  • 描述:①Lead/Principal Application Engineer-Digital Backend and Signoff (Location:深圳)Lead(MS3+/BS6+)/Principal(MS7+/BS9+)Physical Design经验。 Position Description:1. To provide key technical support in digital IC design implementation, product demonstration, and sales presentations.2. To demonstrate strong ability and to be hands-on in RTL-to-GDSII design methodology, including both challenging low power and high performance designs.3. Have real design experience including floorplan and partition, place,CTS, route, STA timing closure, Physical verification, RC extraction, Power Network analysis.4. Real tape-out project for full chip dynamic/static IR-Drop analysis5. Assist in technical evaluation, assessment and delivery of concurrent ASIC/SoCdesigns.6. To play a leading role among other team members, while receive little instructionon routine and general assignments.Position Requirements:1. A bachelor's degree is essential and 4+ years’ experience in IC design,electronic engineering or computer science applications.2. Ability to understand and articulate technical issues, (and knowledge of) design products and their applications.3. Requires working knowledge of one or more programming languages, and effective communication and soft skills.4. An MS degree and/or working experience in multi-nation IC design house is a plus.5. Good communication in English and good work attitude.6. Be familiar with shell/perl/tcl etc. script languag②Principal Application Engineer-Physical Design (SZ) MS3+/BS6+physical design经验,偏功耗分析tool。做过功耗分析尤佳Position Description: ·To provide key technical support in digital IC design implementation, product demonstration, and sales presentations. ·To demonstrate strong ability and to be hands-on in RTL-to-GDSII design methodology, for challenging low power designs, for 200MHz to several GHz big chips. ·Have real design experience including conformal check, logic synthesys, P&R, CTS, SSTA, MMMC to close timing, power and die area. ·Assist in technical evaluation, assessment and delivery of concurrent ASIC/SoC designs. ·To play a leading role among other team members, while receive little instruction on routine and general assignments. Position Requirements: ·A bachelor's degree is essential and 7+ years’ experience in IC design, electronic engineering or computer science applications. ·Ability to understand and articulate technical issues, (and knowledge of) design products and their applications. ·Requires working knowledge of one or more programming languages, and effective communication and soft skills. ·An MS degree and/or working experience in multi-nation IC design house is a plus.QQ/E-mail:1158713891@QQ.comTel/WeChat: 18866916715 Tony
  • 技术设计| 电子半导体| 全球Top美资EDA公司
  • 外资EDA公司数字IC后端/功耗AE 年薪:30-60万| 深圳
  • 描述:①Lead/Principal Application Engineer-Digital Backend and Signoff (Location:深圳)Lead(MS3+/BS6+)/Principal(MS7+/BS9+)Physical Design经验。 Position Description:1. To provide key technical support in digital IC design implementation, product demonstration, and sales presentations.2. To demonstrate strong ability and to be hands-on in RTL-to-GDSII design methodology, including both challenging low power and high performance designs.3. Have real design experience including floorplan and partition, place,CTS, route, STA timing closure, Physical verification, RC extraction, Power Network analysis.4. Real tape-out project for full chip dynamic/static IR-Drop analysis5. Assist in technical evaluation, assessment and delivery of concurrent ASIC/SoCdesigns.6. To play a leading role among other team members, while receive little instructionon routine and general assignments.Position Requirements:1. A bachelor's degree is essential and 4+ years’ experience in IC design,electronic engineering or computer science applications.2. Ability to understand and articulate technical issues, (and knowledge of) design products and their applications.3. Requires working knowledge of one or more programming languages, and effective communication and soft skills.4. An MS degree and/or working experience in multi-nation IC design house/or familiar with EDI/Innovus product is a plus.5. Good communication in English and good work attitude.6. Be familiar with shell/perl/tcl etc. script languag②Principal Application Engineer-Physical Design (SZ) MS3+/BS6+physical design经验,偏功耗分析tool。做过功耗分析尤佳Position Description: ·To provide key technical support in digital IC design implementation, product demonstration, and sales presentations. ·To demonstrate strong ability and to be hands-on in RTL-to-GDSII design methodology, for challenging low power designs, for 200MHz to several GHz big chips. ·Have real design experience including conformal check, logic synthesys, P&R, CTS, SSTA, MMMC to close timing, power and die area. ·Assist in technical evaluation, assessment and delivery of concurrent ASIC/SoC designs. ·To play a leading role among other team members, while receive little instruction on routine and general assignments. Position Requirements: ·A bachelor's degree is essential and 7+ years’ experience in IC design, electronic engineering or computer science applications. ·Ability to understand and articulate technical issues, (and knowledge of) design products and their applications. ·Requires working knowledge of one or more programming languages, and effective communication and soft skills. ·An MS degree and/or working experience in multi-nation IC design house is a plus.QQ/E-mail:1158713891@QQ.comTel/WeChat: 18866916715 Tony
  • 技术设计| 电子半导体| 全球Top美资EDA公司
  • 美资EDA公司数字IC后端/功耗AE 年薪:30-60万| 深圳
  • 描述:①Lead/Principal Application Engineer-Digital Backend and Signoff (Location:深圳)Lead(MS3+/BS6+)/Principal(MS7+/BS9+)Physical Design经验。 Position Description:1. To provide key technical support in digital IC design implementation, product demonstration, and sales presentations.2. To demonstrate strong ability and to be hands-on in RTL-to-GDSII design methodology, including both challenging low power and high performance designs.3. Have real design experience including floorplan and partition, place,CTS, route, STA timing closure, Physical verification, RC extraction, Power Network analysis.4. Real tape-out project for full chip dynamic/static IR-Drop analysis5. Assist in technical evaluation, assessment and delivery of concurrent ASIC/SoCdesigns.6. To play a leading role among other team members, while receive little instructionon routine and general assignments.Position Requirements:1. A bachelor's degree is essential and 4+ years’ experience in IC design,electronic engineering or computer science applications.2. Ability to understand and articulate technical issues, (and knowledge of) design products and their applications.3. Requires working knowledge of one or more programming languages, and effective communication and soft skills.4. An MS degree and/or working experience in multi-nation IC design house/or familiar with EDI/Innovus product is a plus.5. Good communication in English and good work attitude.6. Be familiar with shell/perl/tcl etc. script languag②Principal Application Engineer-Physical Design (SZ) MS3+/BS6+physical design经验,偏功耗分析tool。做过功耗分析尤佳Position Description: ·To provide key technical support in digital IC design implementation, product demonstration, and sales presentations. ·To demonstrate strong ability and to be hands-on in RTL-to-GDSII design methodology, for challenging low power designs, for 200MHz to several GHz big chips. ·Have real design experience including conformal check, logic synthesys, P&R, CTS, SSTA, MMMC to close timing, power and die area. ·Assist in technical evaluation, assessment and delivery of concurrent ASIC/SoC designs. ·To play a leading role among other team members, while receive little instruction on routine and general assignments. Position Requirements: ·A bachelor's degree is essential and 7+ years’ experience in IC design, electronic engineering or computer science applications. ·Ability to understand and articulate technical issues, (and knowledge of) design products and their applications. ·Requires working knowledge of one or more programming languages, and effective communication and soft skills. ·An MS degree and/or working experience in multi-nation IC design house is a plus.QQ/E-mail:1158713891@QQ.comTel/WeChat: 18866916715 Tony
  • 技术设计| 电子半导体| 全球Top美资EDA公司
  • 美资EDA公司数字IC后端AE 年薪:30-60万| 深圳
  • 描述:①Lead/Principal Application Engineer-Digital Backend and Signoff (Location:深圳)Lead(MS3+/BS6+)/Principal(MS7+/BS9+)Physical Design经验。 Position Description:1. To provide key technical support in digital IC design implementation, product demonstration, and sales presentations.2. To demonstrate strong ability and to be hands-on in RTL-to-GDSII design methodology, including both challenging low power and high performance designs.3. Have real design experience including floorplan and partition, place,CTS, route, STA timing closure, Physical verification, RC extraction, Power Network analysis.4. Real tape-out project for full chip dynamic/static IR-Drop analysis5. Assist in technical evaluation, assessment and delivery of concurrent ASIC/SoCdesigns.6. To play a leading role among other team members, while receive little instructionon routine and general assignments.Position Requirements:1. A bachelor's degree is essential and 4+ years’ experience in IC design,electronic engineering or computer science applications.2. Ability to understand and articulate technical issues, (and knowledge of) design products and their applications.3. Requires working knowledge of one or more programming languages, and effective communication and soft skills.4. An MS degree and/or working experience in multi-nation IC design house/or familiar with EDI/Innovus product is a plus.5. Good communication in English and good work attitude.6. Be familiar with shell/perl/tcl etc. script languag②Principal Application Engineer-Physical Design (SZ) MS3+/BS6+physical design经验,偏功耗分析。做过功耗分析尤佳Position Description: ·To provide key technical support in digital IC design implementation, product demonstration, and sales presentations. ·To demonstrate strong ability and to be hands-on in RTL-to-GDSII design methodology, for challenging low power designs, for 200MHz to several GHz big chips. ·Have real design experience including conformal check, logic synthesys, P&R, CTS, SSTA, MMMC to close timing, power and die area. ·Assist in technical evaluation, assessment and delivery of concurrent ASIC/SoC designs. ·To play a leading role among other team members, while receive little instruction on routine and general assignments. Position Requirements: ·A bachelor's degree is essential and 7+ years’ experience in IC design, electronic engineering or computer science applications. ·Ability to understand and articulate technical issues, (and knowledge of) design products and their applications. ·Requires working knowledge of one or more programming languages, and effective communication and soft skills. ·An MS degree and/or working experience in multi-nation IC design house is a plus.QQ/E-mail:1158713891@QQ.comTel/WeChat: 18866916715 Tony
  • 生产制造| 电子半导体| 全球Top美资EDA公司
  • 【深圳IC】美资EDA公司数字后端A... 年薪:30-60万| 深圳
  • 描述:①Lead/Principal Application Engineer-Digital Backend and Signoff (Location:深圳)Lead(MS3+/BS6+)/Principal(MS7+/BS9+)Physical Design经验。 Position Description:1. To provide key technical support in digital IC design implementation, product demonstration, and sales presentations.2. To demonstrate strong ability and to be hands-on in RTL-to-GDSII design methodology, including both challenging low power and high performance designs.3. Have real design experience including floorplan and partition, place,CTS, route, STA timing closure, Physical verification, RC extraction, Power Network analysis.4. Real tape-out project for full chip dynamic/static IR-Drop analysis5. Assist in technical evaluation, assessment and delivery of concurrent ASIC/SoCdesigns.6. To play a leading role among other team members, while receive little instructionon routine and general assignments.Position Requirements:1. A bachelor's degree is essential and 4+ years’ experience in IC design,electronic engineering or computer science applications.2. Ability to understand and articulate technical issues, (and knowledge of) design products and their applications.3. Requires working knowledge of one or more programming languages, and effective communication and soft skills.4. An MS degree and/or working experience in multi-nation IC design house/or familiar with EDI/Innovus product is a plus.5. Good communication in English and good work attitude.6. Be familiar with shell/perl/tcl etc. script languag②Principal Application Engineer-Physical Design (SZ) MS3+/BS6+physical design经验,做过功耗分析尤佳Position Description: ·To provide key technical support in digital IC design implementation, product demonstration, and sales presentations. ·To demonstrate strong ability and to be hands-on in RTL-to-GDSII design methodology, for challenging low power designs, for 200MHz to several GHz big chips. ·Have real design experience including conformal check, logic synthesys, P&R, CTS, SSTA, MMMC to close timing, power and die area. ·Assist in technical evaluation, assessment and delivery of concurrent ASIC/SoC designs. ·To play a leading role among other team members, while receive little instruction on routine and general assignments. Position Requirements: ·A bachelor's degree is essential and 7+ years’ experience in IC design, electronic engineering or computer science applications. ·Ability to understand and articulate technical issues, (and knowledge of) design products and their applications. ·Requires working knowledge of one or more programming languages, and effective communication and soft skills. ·An MS degree and/or working experience in multi-nation IC design house is a plus.QQ/E-mail:1158713891@QQ.comTel/WeChat: 18866916715 Tony
  • 生产制造| 电子半导体| 某知名外资公司
  • 【深圳】美资公司数字IC后端AE 年薪:30-60万| 深圳
  • 描述:①Lead/Principal Application Engineer-Digital Backend and Signoff (Location:深圳)Lead(MS3+/BS6+)/Principal(MS7+/BS9+)Physical Design经验。 Position Description:1. To provide key technical support in digital IC design implementation, product demonstration, and sales presentations.2. To demonstrate strong ability and to be hands-on in RTL-to-GDSII design methodology, including both challenging low power and high performance designs.3. Have real design experience including floorplan and partition, place,CTS, route, STA timing closure, Physical verification, RC extraction, Power Network analysis.4. Real tape-out project for full chip dynamic/static IR-Drop analysis5. Assist in technical evaluation, assessment and delivery of concurrent ASIC/SoCdesigns.6. To play a leading role among other team members, while receive little instructionon routine and general assignments.Position Requirements:1. A bachelor's degree is essential and 4+ years’ experience in IC design,electronic engineering or computer science applications.2. Ability to understand and articulate technical issues, (and knowledge of) design products and their applications.3. Requires working knowledge of one or more programming languages, and effective communication and soft skills.4. An MS degree and/or working experience in multi-nation IC design house/or familiar with EDI/Innovus product is a plus.5. Good communication in English and good work attitude.6. Be familiar with shell/perl/tcl etc. script languag②Principal Application Engineer-Physical Design (SZ) MS3+/BS6+physical design经验,做过功耗分析尤佳Position Description: ·To provide key technical support in digital IC design implementation, product demonstration, and sales presentations. ·To demonstrate strong ability and to be hands-on in RTL-to-GDSII design methodology, for challenging low power designs, for 200MHz to several GHz big chips. ·Have real design experience including conformal check, logic synthesys, P&R, CTS, SSTA, MMMC to close timing, power and die area. ·Assist in technical evaluation, assessment and delivery of concurrent ASIC/SoC designs. ·To play a leading role among other team members, while receive little instruction on routine and general assignments. Position Requirements: ·A bachelor's degree is essential and 7+ years’ experience in IC design, electronic engineering or computer science applications. ·Ability to understand and articulate technical issues, (and knowledge of) design products and their applications. ·Requires working knowledge of one or more programming languages, and effective communication and soft skills. ·An MS degree and/or working experience in multi-nation IC design house is a plus.QQ/E-mail:1158713891@QQ.comTel/WeChat: 18866916715 Tony
  • 生产制造| 电子半导体| 某知名外资公司
  • 【深圳】美资公司数字后端/功耗分... 年薪:30-60万| 深圳
  • 描述:①Lead/Principal Application Engineer-Digital Backend and Signoff (Location:深圳)Lead(MS4+/BS6+)/Principal(MS7+/BS9+)Physical Design经验。熟悉cadence工具优先。 Position Description:1. To provide key technical support in digital IC design implementation, product demonstration, and sales presentations.2. To demonstrate strong ability and to be hands-on in RTL-to-GDSII design methodology, including both challenging low power and high performance designs.3. Have real design experience including floorplan and partition, place,CTS, route, STA timing closure, Physical verification, RC extraction, Power Network analysis.4. Real tape-out project for full chip dynamic/static IR-Drop analysis5. Assist in technical evaluation, assessment and delivery of concurrent ASIC/SoCdesigns.6. To play a leading role among other team members, while receive little instructionon routine and general assignments.Position Requirements:1. A bachelor's degree is essential and 4+ years’ experience in IC design,electronic engineering or computer science applications.2. Ability to understand and articulate technical issues, (and knowledge of) design products and their applications.3. Requires working knowledge of one or more programming languages, and effective communication and soft skills.4. An MS degree and/or working experience in multi-nation IC design house/or familiar with EDI/Innovus product is a plus.5. Good communication in English and good work attitude.6. Be familiar with shell/perl/tcl etc. script languag②Principal Application Engineer-Physical Design (SZ) MS4+/BS6+physical design经验,做过功耗分析(EPS/voltus/Redhawk)尤佳Position Description: ·To provide key technical support in digital IC design implementation, product demonstration, and sales presentations. ·To demonstrate strong ability and to be hands-on in RTL-to-GDSII design methodology, for challenging low power designs, for 200MHz to several GHz big chips. ·Have real design experience including conformal check, logic synthesys, P&R, CTS, SSTA, MMMC to close timing, power and die area. ·Assist in technical evaluation, assessment and delivery of concurrent ASIC/SoC designs. ??To play a leading role among other team members, while receive little instruction on routine and general assignments. Position Requirements: ·A bachelor's degree is essential and 7+ years’ experience in IC design, electronic engineering or computer science applications. ·Ability to understand and articulate technical issues, (and knowledge of) design products and their applications. ·Requires working knowledge of one or more programming languages, and effective communication and soft skills. ·An MS degree and/or working experience in multi-nation IC design house is a plus.QQ/E-mail:1158713891@QQ.comTel/WeChat: 18866916715 Tony
  • 生产制造| 电子半导体| 全球Top美资EDA公司
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